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  • ...due to their strong internal order and mixed (metallic and covalent/ionic) bonding, respecitvely. ...cs of [[aluminium]] and [[gold]] are a significant cause of [[wire bonding|wire bond]] failures in [[semiconductor devices]] and other [[microelectronics]
    2 KB (314 words) - 13:44, 18 May 2009
  • ...r]] in the rubber cross-link to produce [[copper sulfide]], which improves bonding of the bead to the rubber. Beads are inflexible and inelastic, and provide ...es and belts. A creel room is a facility that houses hundreds of fabric or wire spools that are fed into the calender. Calenders utilize downstream equipme
    14 KB (2,137 words) - 09:56, 12 December 2009